3D Microelectronic Packaging

☆☆☆☆☆ (0 reviews)

Show price history

Lowest price (incl. delivery)

163,75 EUR

Typical price165,16 PLN

Lowest (90 days)148,75 PLN

Offers3

Last updated1 สัปดาห์ที่แล้ว

See best offer

ผู้ขาย	Product price	Delivery	รวม	ความพร้อมจำหน่าย	Updated
SP SpringerNatureLink Shop INT	148,75 EUR	15,00 EUR	163,75 EUR	มีจำหน่าย	21 ชั่วโมงที่แล้ว	View offer
SP Springer Nature Author	148,75 EUR	15,00 EUR	163,75 EUR	มีจำหน่าย	1 สัปดาห์ที่แล้ว	View offer
SP SpringerNatureLink Shop INT	25 739,00 JPY	19,00 JPY	25 758,00 JPY	มีจำหน่าย	20 ชั่วโมงที่แล้ว	View offer

ราคาและความพร้อมจำหน่ายอาจมีการเปลี่ยนแปลง อัปเดตล่าสุด: 08.08.2026 22:50.

EAN 9789811570926

Springer Nature

0,0

☆☆☆☆☆

0 reviews

5★ 0%

4★ 0%

3★ 0%

2★ 0%

1★ 0%

Product reviews

Name

Rating

Your review

No reviews yet — be the first!

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.