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3D Microelectronic Packaging

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163,75 EUR

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Lowest (90 days)148,75 PLN

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판매자	Product price	Delivery	합계	재고 여부	Updated
SP SpringerNatureLink Shop INT	148,75 EUR	15,00 EUR	163,75 EUR	구매 가능	16시간 전	View offer
SP Springer Nature Author	148,75 EUR	15,00 EUR	163,75 EUR	구매 가능	1주 전	View offer
SP SpringerNatureLink Shop INT	25 739,00 JPY	19,00 JPY	25 758,00 JPY	구매 가능	14시간 전	View offer

가격과 재고 여부는 변경될 수 있습니다. 마지막 업데이트: 08.08.2026 22:50.

EAN 9789811570926

Springer Nature

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This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.