Pricelists.org Pricelists.org Log in Sign up

Microelectronics Packaging Handbook

☆☆☆☆☆ (0 reviews)
Show price history
Microelectronics Packaging Handbook
Lowest price (incl. delivery)
349,99 USD
Typical price387,85 PLN
Lowest (90 days)369,24 PLN
Offers5
Last updated4 days ago
See best offer
Price history (90 days)
Full history
2026-08-08 2026-08-15
Price History
Updated AtPrice
2026-08-08374,49
2026-08-15369,24
Seller Product price Delivery Total Availability Updated
SP SpringerNatureLink Shop INT 349,99 USD free 349,99 USD Available 4 days ago View offer
SP SpringerNatureLink Shop INT 349,99 USD 29,00 USD 378,99 USD Available 4 days ago View offer
SP SpringerNatureLink Shop INT 379,99 USD 29,00 USD 408,99 USD Available 4 days ago View offer
SP SpringerNatureLink Shop INT 413,00 EUR free 413,00 EUR Available 4 days ago View offer
SP Springer Nature Author 413,00 EUR 29,00 EUR 442,00 EUR Available 1 week ago View offer

Prices and availability may change. Last Updated: 15.08.2026 07:35.

EAN 9780412084416
Springer Nature
0,0
☆☆☆☆☆
0 reviews
5★ 0%
4★ 0%
3★ 0%
2★ 0%
1★ 0%

Product reviews

Rating
No reviews yet — be the first!
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool­ ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Similar products