Kingston Technology KSM32SED8/16HE memory module 16 GB 1 x 16 GB DDR4 3200 MT/s ECC

Power Supply: VDD = 1.2V VDDQ = 1.2V VPP = 2.5V VDDSPD = 2.20V to 3.60V Functionality and operations comply with the DDR4 SDRAM datasheet 16 internal banks Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for the banks in the same or different bank group accesses are available Data transfer rates: PC4-3200, PC4-2933, PC4-2666, PC4-2400, PC4-2133, PC4-1866, PC4-1600 Bi-Directional Differential Data Strobe 8 bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop) Supports ECC error correction and detection On-Die Termination (ODT) Temperature sensor with integrated SPD This product is in compliance with the RoHS directive Per DRAM Addressability is supported Internal Vref DQ level generation is available Write CRC is supported at all speed grades CA parity (Command/Address Parity) mode is supported RoHS Compliant and Halogen-Free Kingston's KSM32SED8/16HE is a 2G x 72-bit (16GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM) w/ parity, 2Rx8, ECC, memory module, based on eighteen 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each 260-pin SODIMM uses gold contact fingers. Features JEDEC standard Yes SPD profile Yes Programming power voltage (VPP) 2.5 V Row active time 32 ns Row cycle time 45.75 ns Module configuration 2048M x 72 Memory voltage 1.2 V Memory ranking 2 Memory data transfer rate 3200 MT/s CAS latency 22 ECC Yes Memory form factor 260-pin SO-DIMM Component for Server Internal memory type DDR4 Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Buffered memory type Unregistered (unbuffered) Operational conditions Storage temperature (T-T) -55 - 100 °C Operating temperature (T-T) 0 - 85 °C Technical details Compliance certificates RoHS Weight & dimensions Height 30 mm Depth 3.7 mm Width 69.6 mm leaflet