HPE Intel Xeon E7-4809 v2 processor 1.9 GHz 12 MB L3 Tray

Intel® Xeon® E7 V2 Family E7-4809V2 1.9 GHz 12 MB L3 LGA 2011 (Socket R) Processor cores: 6 22 nm 64-bit 105 W Maximum internal memory supported by processor: 1.54 TB DDR3-SDRAM Tray We are in a multi-year journey to turn HP around, and we have put in place a plan to restore HP to growth. We know where we need to go, and we're making progress.We continue to drive product innovation in our core markets, with a focus on cloud, security, and big data.We see big opportunities ahead, and we are well positioned to take advantage of these opportunities with our remarkable set of assets and strengths. We have the people, the plan, and the foundation in place to help us succeed on the next phase of the journey. Processor Memory bandwidth supported by processor (max) 68 GB/s Number of QPI links 3 Bus type QPI Thermal Design Power (TDP) 105 W Processor cache type L3 Processor cache 12 MB Processor operating modes 64-bit System bus rate 6.4 GT/s Processor threads 12 Component for Server/workstation Processor lithography 22 nm Processor socket LGA 2011 (Socket R) Processor cores 6 Processor base frequency 1.9 GHz Processor model E7-4809V2 Processor family Intel® Xeon® E7 V2 Family Memory ECC Yes Memory channels Quad-channel Memory clock speeds supported by processor 1066,1333 MHz Memory types supported by processor DDR3-SDRAM Maximum internal memory supported by processor 1.54 TB Graphics On-board graphics card No Features Scalability S4S Embedded options available No PCI Express slots version 3.0 Maximum number of PCI Express lanes 32 Market segment Server Execute Disable Bit Yes Idle States Yes Thermal Monitoring Technologies Yes Processor special features Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel® Secure Key Yes Intel TSX-NI No Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® Turbo Boost Technology No Intel® AES New Instructions (Intel® AES-NI) Yes Intel Trusted Execution Technology Yes Enhanced Intel SpeedStep Technology Yes Operational conditions Tcase 68 °C Packaging data Package type Tray Package depth 45 mm Package width 52 mm Other features Intel® Virtualization Technology (Intel® VT) VT-d