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3D Microelectronic Packaging

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Lowest price (incl. delivery)

25 758,00 JPY

Typical price229,75 PLN

Lowest (90 days)59,70 PLN

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2026-08-08 2026-08-15

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Aggiornato il	Prezzo
2026-08-08	59,70
2026-08-15	196,19

Venditore	Product price	Delivery	Totale	Disponibilità	Updated
SP SpringerNatureLink Shop INT	25 739,00 JPY	19,00 JPY	25 758,00 JPY	Disponibile	1 giorno fa	View offer
SP SpringerNatureLink Shop INT	212,50 EUR	15,00 EUR	227,50 EUR	Disponibile	1 giorno fa	View offer
SP Springer Nature Author	212,50 EUR	19,00 EUR	231,50 EUR	Disponibile	1 settimana fa	View offer
VI VitalSource	1 132,80 ZAR	25,00 ZAR	1 157,80 ZAR	Disponibile	1 settimana fa	View offer

I prezzi e la disponibilità possono variare. Ultimo aggiornamento: 08.08.2026 06:36.

EAN 9789811570896

Springer Nature

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This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.